Semiconductor----Silicon Wafer Polishing 

Briefly talk about the steps of silicon wafer polishing as below :

In the first step, the front side of the silicon wafer is treated, an adhesive is coated on the back of the silicon wafer, the silicon wafer is adhered to the ceramic board, the corrosion layer on the front surface of the silicon wafer is removed, and the silicon wafer is separated from the ceramic board by using a spatula, and cleaned and removed For the adhesive on the back of the silicon wafer, use a thickness measuring device to measure the thickness of the silicon wafer.

In the second step, the backside of the silicon wafer is treated, an adhesive is coated on the front of the silicon wafer, the silicon wafer is adhered to the ceramic board, the corrosion layer on the back of the silicon wafer is removed, and the silicon wafer is detached from the ceramic board with a spatula, and cleaned and removed Adhesive on the front of the silicon wafer to measure the flatness of the surface of the silicon wafer, and use a thickness measuring device to measure the thickness of the silicon wafer.

In the third step, the front surface of the silicon wafer is finally trimmed, an adhesive is coated on the back surface of the silicon wafer, the silicon wafer is adhered to the ceramic board, the corrosion layer on the front surface of the silicon wafer is removed, and the silicon wafer is detached from the ceramic board with a spatula and cleaned Remove the adhesive and particles from the back of the silicon wafer.